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Soldering of Ceramics

C-SOLDER (Type: SAC-1B)

 

 I.                    FEATURES OF TECHNOLOGY

Joining of ceramics either to themselves or to metals usually requires pre-treatment based on metallisation or application of active brazing alloys. There is a wide range of active brazing materials however, due to high brazing temperature, usually above 750°C, joining associates to stress failure during the cooling cycle. C-Solder, on the other hand, as a tin based lead-free alloy, allows fluxless soldering of ceramics at low temperature.

 

II.                  FEATURES OF THE PRODUCT

C-SOLDER tin-based lead-free low-temperature soldering alloys enable joining of various materials generally considered as difficult to solder, including ceramics, in both ceramic-ceramic and ceramic-metal arrangements. The soldering of ceramics, using C-Solder Type: SAC-1B, may be performed in air, at temperatures below 450°C with the use of classic or ultrasonic soldering iron. 

 

C-SOLDER Type: SAC-1B:

  • Excellent wetting of ceramics with no need of flux.
  • Suitability for bonding in ceramic-ceramic and ceramic-metal systems.
  • Soldering temperatures below 450°C.
  • Good mechanical and thermal properties.
  • Lead free.
  • Flux free.

III.               How it works (video)?

 

CAMETICS video blog No 8 - Soldering of ceramics

 

IV.              Where to buy?

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