C-SOLDER (Type: SAC-1B)
I. FEATURES OF TECHNOLOGY
Joining of ceramics either to themselves or to metals usually requires pre-treatment based on metallisation or application of active brazing alloys. There is a wide range of active brazing materials however, due to high brazing temperature, usually above 750°C, joining associates to stress failure during the cooling cycle. C-Solder, on the other hand, as a tin based lead-free alloy, allows fluxless soldering of ceramics at low temperature.
II. FEATURES OF THE PRODUCT
C-SOLDER tin-based lead-free low-temperature soldering alloys enable joining of various materials generally considered as difficult to solder, including ceramics, in both ceramic-ceramic and ceramic-metal arrangements. The soldering of ceramics, using C-Solder Type: SAC-1B, may be performed in air, at temperatures below 450°C with the use of classic or ultrasonic soldering iron.
C-SOLDER Type: SAC-1B:
- Excellent wetting of ceramics with no need of flux.
- Suitability for bonding in ceramic-ceramic and ceramic-metal systems.
- Soldering temperatures below 450°C.
- Good mechanical and thermal properties.
- Lead free.
- Flux free.
III. How it works (video)?
|CAMETICS video blog No 8 - Soldering of ceramics|
IV. Where to buy?